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4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 977083CM Specification for Automatic BGA Repair

Productgegevens

Plaats van herkomst: China

Merknaam: Wisdomshow BGA

Document: Productenbrochure PDF

Betaling en verzendvoorwaarden

Min. bestelaantal: 1

Prijs: 18800

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Productgegevens

Productbeschrijving

Markeren: 
                                                                                                                                                                                                                                                                                                                                                                                                            4200W Rated Capacity BGA Rework Station, 100% Duty Cycle BGA Reballing Machine, 97*70*83CM Specification BGA Repair Machine
                      

Modelnr.:	WDS-850	Nominale capaciteit:	4200W
Geschatte plichtscyclus:	100%	Machinetype:	BGA-reparatiemachine
Gewicht:	210 kg	Afmetingen:	977083 CM
Productiecapaciteit:	5000	Vermogen opwarmer:	1200W
Donsverwarmer Vermogen:	1200W	IR-vermogen:	5000W
Maximum plaatgrootte:	650*610mm	Voorverwarmgebied:	500*420 mm
Hittebestendigheid:	1800 C	Drukbeheersing:	10 gram
Temperatuurregeling:	8 segmenten

Modelnr.:	WDS-850
Nominale capaciteit:	4200W
Geschatte plichtscyclus:	100%
Machinetype:	BGA-reparatiemachine
Gewicht:	210 kg
Afmetingen:	977083 CM
Productiecapaciteit:	5000
Vermogen opwarmer:	1200W
Donsverwarmer Vermogen:	1200W
IR-vermogen:	5000W
Maximum plaatgrootte:	650*610mm
Voorverwarmgebied:	500*420 mm
Hittebestendigheid:	1800 C
Drukbeheersing:	10 gram
Temperatuurregeling:	8 segmenten

4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair

BGA Rework Station - Automatic Chip Removal and Mounting Machine

Product Overview

Our BGA Rework Station is designed for professional chip replacement and repair in laptops, mobile phones, gaming consoles (Xbox 360, PS3/PS4), and other electronic devices. Ideal for repair shops and factories providing after-sales service and component rework.

Repair Process

Desoldering: Separate BGA chip from motherboard
Pad cleaning
Reballing or direct BGA chip replacement
Precision alignment (using silk frame or optical camera)
Soldering: Install new BGA chip

Applications

Watch/Mobile/Cell phone repair
Notebook/Laptop/Computer repair
XBOX 360/PS2/PS3/PS4/Wii game console repair
SMD/SMT/IC BGA rework including iCloud removal
BGA VGA, CPU, GPU, ECU and car motherboard soldering/desoldering
BGA chips, QFP QFN chip, PC, PLCC PSP PSY rework

Key Features

Integrated hot air head and mounting head with automatic soldering/desoldering
Independent 3-zone heating system with synchronized upper/lower heater movement
High-precision PCB slider for accurate BGA mounting
German-imported preheating table (500×420mm) with heat-resistant glass (up to 1800°C)
Motor-controlled X/Y axis movement for precise alignment
Maximum PCB size capacity: 650×610mm with no repair dead corners
Built-in vacuum pump with 360° rotation and fine-adjustable suction nozzle
Automatic BGA height detection with pressure control (down to 10g)