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Auto WDS-750 BGA werkstation 6800W met temperatuurregelsysteem

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October 23, 2024
Categorieverbinding: BGA-verballeringsmachine
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Tags:
#Laserafdrukmachine #Automatische herballeringsmachine #Laptop BGA machine
Kort: Discover the WDS-750 Optical Alignment BGA Reballing Machine, a high-precision workstation with 3 independent heating zones and advanced temperature control. Perfect for BGA, QFN, and QFP components, this machine ensures ±1℃ precision and automated functions for flawless rework.
Gerelateerde Productkenmerken:
  • Touch screen interface for easy setup of heating time, temperature, and cooling parameters.
  • Panasonic PLC with independent temperature control module and 4 sensors for accurate chip point monitoring.
  • 3 independent heating zones with customizable temp, time, and rise rate for each zone.
  • Auto feed, pick up, and blowing chip functions with optical alignment for central positioning.
  • Multifunction modes including weld, remove, mount, and manual/semi-auto options.
  • High precision K-type thermocouple closed-loop control for ±1℃ temperature accuracy.
  • 500 pixel HD camera with 15-inch LCD and micrometer X/Y/Z axis adjustment for 0.01-0.02mm precision.
  • Upper heating head and placement head designed as 2-in-1 with customizable nozzles.
Vraagstukken:
  • What types of components can the WDS-750 BGA Reballing Machine handle?
    The machine is designed for lead-free technology, double-deck BGA, QFN, QFP, capacitance resistance, and other components.
  • How precise is the temperature control in the WDS-750?
    The machine uses high precision K-type thermocouple closed-loop control, ensuring temperature precision within ±1℃.
  • What is the maximum PCB size the WDS-750 can accommodate?
    The WDS-750 can handle PCBs up to 570×480mm in size, with a minimum size of 10×10mm.
  • Does the WDS-750 offer automated functions?
    Yes, it features auto feed, pick up, and blowing chip functions, along with optical alignment for central positioning.
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